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Product Description

WS889 water soluble lead free solder paste is formulated to provide minimal graping and excellent wetting qualities. WS889 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65-85 F) and relative humidity (25-65 % RH). Residues are amber in color and can be cleaned using warm water. WS889 is a good printing paste that produces good cosmetics with clean and shiny solder joints. This product is classified ORH0.

Attributes

Excellent volume transfer efficiency
High resistance to slup and dry-out, even in extreme humidity condition and RH
High speed stencil printing up to 100mm/sec
Excellent low voiding performance that exceeds IPC Class II requirement
Clear residue
Very cleanable paste residue with hot DI water (120-140F)

Production Details

Shelf Life: One year

Standard Lead Time

4 work days

Available Containers

30 gram syringe
100 gram syringe
250 gram jar
500 gram jar
500 gram cartridge
600 gram cartridge
1300 gram cartridge
7 pound cartridge