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Product Description

WS159 is a water soluble, leaded solder paste that is classified ORH0. WS159 was formulated to meet the requirements for reliable solder joints in PCB Assemblies along with a large operating window. Thus, WS159 was designed to provide humidity tolerance and excellent wetting. WS159 remains stable in a wide range of temperatures (65-85F) and relative humidity (25-65%RH). While maintaining a stable viscosity and exceptional cosmetics, WS159 exhibits low voiding characteristics. The residue for this product is easily visible and removable with warm water.

Attributes

Excellent print volume consistency with surface area ratios (SAR) as low as 0.50 when used with the NanoSlic stencil technology
Low-hydroscopic formulation resistant to slump and dry-out.
Wide reflow window with excellent wetting characteristics on all surface finishes
Very stable product for a water soluble paste that allows storage of this paste up to 6 months at room temperature and one year if refrigerated
Low voiding and high reliability composition
Compatible in either nitrogen or air reflow
Formulated for leaded alloys and Types 3,4 and 5 powders

Production Details

Shelf Life: One year

Standard Lead Time

4 work days

Available Containers

30 gram syringe
100 gram syringe
250 gram jar
500 gram jar
500 gram cartridge
600 gram cartridge
1300 gram cartridge
7 pound cartridge