Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market today.

Utilizing the latest stencil laser technology and Datum Alloys new Fine Grain stencil material, UltraSlic™ FG stencils have superior aperture registration, outstanding, repeatable paste release below surface area ratios of 0.5, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.. At prices 20%-50% less than electroform, our customers can now get the performance they need while reducing their overall cost. UltraSlic™ FG is a stainless steel with superior fatigue strength, super smooth surface and elevated wear factor. UltraSlic™ FG has all the benefits of Slic Stainless Steel, such as excellent flatness and the ability to be half-etched without distortion.

Standard stainless steel has a grain size of 20 to 30 microns. UltraSlic™ FG has a grain size of just 1 to 2 microns. This results in a huge increase in the number of grains in the substrate and thus the number of grain boundaries. Energy is absorbed at the grain boundary so this increase in the number of grain boundaries means higher energy absorption. This means that we are able to provide a material with hardness greater than 430HV. Like Slic, UltraSlic™ FG also has the ‘wetcoat’ surface treatment to deliver enhanced lubrication and wetting characteristics. Finer Printing for solder paste you will see improved print quality and release and especially with paste types 6, 7 and 8 where PSD can be as low as 1 or 2 microns.